Rehm Thermal Systems GmbH

Rehm Thermal Systems GmbH
Leinenstrasse 7


Phone: +49 (0)7344/9606-531

Fax: +49 (0)7344/9606-525


Rehm Thermal Systems GmbH articles

Displaying 1 - 11 of 11

Low-void soldering by flexible vacuum system

Low-void soldering by flexible vacuum system
The demand for high-performance electronics is growing worldwide, driven by higher demand from for example the electro-mobility and LED global lighting industries. These different electronic applications require solder joints with as few voids as possible in both their structure and connection. 
28th August 2019

Specialist book on fundamentals of reflow soldering

Specialist book on fundamentals of reflow soldering
Plumbing the depths of reflow technology with the specialist books of Dr Hans Bell (Rehm Thermal Systems): in the wake of four successful volumes, the publication of the fifth marks the final part in the Rehm series ‘Reflow technology – Fundamentals of Reflow Soldering’. 
30th April 2019

Look further, go beyond at SMTconnect

Look further, go beyond at SMTconnect
Trade fair for the electronics industry, SMTconnect (formerly SMT Hybrid Packaging), will be opening its doors in Nuremberg from 7th to 9th May. Rehm Thermal Systems has announced that it will be attending again this year, and will be found in Hall 4A, at Stand 100.
16th April 2019

Lacquering system with the option of 2K encapsulation

Lacquering system with the option of 2K encapsulation
In modern electronics manufacturing it remains important to protect sensitive assemblies from external influences, reliably, safely and as well as possible. Yet continuing development and miniaturisation in electronics are creating ever more complex assemblies that call for an even more precise level of protection. 
5th February 2019

Rehm and Electrolube: coating made easy

Rehm and Electrolube: coating made easy
A collaboration that benefits electronics manufacturers around the world: That is what the cooperation between Rehm Thermal Systems and Electrolube is all about. The perfect interaction between coating systems and lacquers ensures optimum results during jetting, dispensing, spraying or curtain coating.
15th August 2018

Thermal system specialist at productronica India

Thermal system specialist at productronica India
Rehm will be attending productronica in India for the first time in September (14 to 16). The international electronics industry is focusing on India as a growth market for innovation and is playing host to discussions about the latest production strategies and technologies. India, second only to China, is one of the most populous countries of the world with nearly 1.3 billion people. In addition to this, India is also considered to be one of the 20 most important industrial emerging economies (G20). 
30th August 2017

Rehm ups testing capability at its Technology Centre

In order to be able to more closely inspect the quality directly after the printing or painting process, two new inspection systems of the TROI series from Pemtron are now in use at the Rehm Technology Centre in Blaubeuren. In Germany, the Korean equipment manufacturer is distributed by ANS answer elektronik.
13th April 2017

Residue management system extends maintenance cycles

Residue management system extends maintenance cycles
Soldering fumes, aerosols and solid particles (residues) have to be removed from the process cycle and are also produced when soldering electronic assemblies. Rehm Thermal Systems has recognised effective residue management for reflow convection soldering with the VisionXP+.
7th February 2017

Systems harden protective coatings

To ensure sensitive electronic components function reliably even in adverse conditions, protective coatings are applied to circuit boards during the manufacturing process. In addition to its RDS Series, Rehm Thermal Systems is now offering two systems for the optimal hardening of such protective coatings – the vertical dryer RVDS and a compact UV hardening system.
16th December 2015

Great cooling means perfect soldering results

As well as a water-cooled standard solution with adjustable ventilation system, there are several additional options for large and high-mass boards, primarily a power cooling unit as an extended cooling tract or a bottom cooling system. The Rehm company has also designed the first coolant-water-free reflow soldering system, which utilises liquid nitrogen cooling. Rehm's VisionX range transforms the classic cooling tract into a two or four-layer system, depending on the facility.
12th October 2015

Rehm Thermal Systems Announces Three Next-generation Soldering Solutions

Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere – the Vacuum Soldering process. Rehm offers three VS Series Vacuum Soldering system models. They’re all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging.
25th January 2013

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