Tanaka Kikinzoku Kogyo K.K

22nd floor, TOKYO BUILDING, 7-3,
Marunouchi 2-Chome, Chiyoda-ku,

Tokyo 100-6422

Phone: +81-3-6311-5551

Fax: +81-3-6311-5571

Web: gold.tanaka.co.jp

Tanaka Kikinzoku Kogyo K.K articles

Displaying 1 - 5 of 5

Tanaka to exhibit at FC EXPO 2016

Tanaka to exhibit at FC EXPO 2016
Tanaka Precious Metals will exhibit at "FC EXPO 2016 - 12th International Hydrogen and Fuel Cell Expo," one of the world's largest fuel cell exhibitions, which will be held at Tokyo Big Sight from Wednesday, March 2 until Friday, March 4, 2016. 
29th February 2016

Tanaka will be at MD&M West

Tanaka has announced it will exhibit at Medical Design & Manufacturing West (MD&M West) to be held in Anaheim, USA, from February 9 to 11. Tanaka Kikinzoku Kogyo develops and manufactures a wide range of precious metal materials, including electrodes and radiopaque markers using knowledge of precious metals built up over many years.
4th February 2016

Electrical contact material is Cadmium-free

Electrical contact material is Cadmium-free
Tanaka Kikinzoku Kogyo K.K. has developed a cadmium-free electrical contact material for use primarily in vehicles and smartphones with what is said to be improved sliding wear resistance compared to existing products. Full scale production of CDF-10 will start on December 1st.
26th November 2015

Cup-type plating lab equipment for wafers offers equivalent films to mass-production machines

Tanaka Holdings has announced that Electroplating Engineers of Japan, Limited (EEJA), which operates the Tanaka Precious Metals' plating business, has developed and launched the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines.
22nd July 2015

Electroless plating process enables economical OFET formation

Electroplating Engineers of Japan, which operates the Tanaka Precious Metals Group's plating business, together with Professor Junichi Takeya, Graduate School of Frontier Sciences, University of Tokyo, has developed the world's first technology for the simultaneous formation of contact electrodes for p-type and n-type1 Organic-semiconductor Field Effect Transistors (OFETs) using an electroless plating process.
16th March 2015

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