3D technology, which combines the versatility of the two-shot MID moulding process with the speed and precision of LDS, has been introduced by Molex. While meeting stringent medical grade guidelines, the MediSpec Moulded Interconnect Device/Laser Direct Structuring (MID/LDS) technology delivers integrated fine-pitch 3D circuitry in a single moulded package suitable for high density medical devices.
Allowing for pattern modification with lines and spaces down to 0.10mm and circuitry pitch down to 0.35mm, LDS uses a 3D laser to image micro-line electronic circuitry onto a variety of RoHS-compliant moulded plastics. This is scalable from small to large volume production quantities.
MediSpec MID/LDS selective trace solutions can be customised with connectors, circuit vias, switch pads, sensors and antennas. For SMT applications, integrated chips, capacitors and inductors can be soldered directly to the selective plating on the RoHS-compliant plastic. Reducing weight and increasing functionality, insert and overmoulding allows for built-in features.
The MediSpec MID/LDS 3D technology is suitable for blood glucose meters, home healthcare telemetry, catheter interfaces, pulse oximetry sensors and hearing aids. To ensure product reliability and performance criteria are met, Molex provides MID/LDS quality control testing.
“Surpassing the capabilities of existing 2D technologies, MediSpec MID/LDS 3D shielded circuitry allows medical device designers to integrate highly complex electrical and mechanical features into highly compact applications,” said Steve Zeilinger, Group Product Manager, Molex.
“An excellent value proposition for miniaturisation strategies, our MediSpec 3D interconnect package delivers significant space savings over traditional PCB and flex circuit designs,” adds Zeilinger. “The power of MID/LDS technology to address miniaturisation, convergence and healthcare trends in the medical industry is phenomenal.”