Component Manufacturing

Displaying 111 - 120 of 123

Radiometer simplifies the monitoring of UV-curing

Radiometer simplifies the monitoring of UV-curing
Offering accurate and repeatable measurement of UV light, the ACCU-CAL 150 is a simple to use radiometer from Intertronics. This radiometer can measure UV light up to 10W/cm2 emitted from stationary light-curing flood lamps or lamps used in conveyor based processes and can also be used to determine intensity (mW/cm2) or total energy as derived from intensity and exposure time (mJ/cm2).
27th February 2014

Pass through dry cabinet features double-sided doors for easy access

Pass through dry cabinet features double-sided doors for easy access
Featuring double-sided doors for easy access on either side of the SMT line, the McDry DXU-401DP pass through dry cabinet has been announced by Seika. 
26th February 2014

Compact mass flow controller follows anemometry principle

Compact mass flow controller follows anemometry principle
With the introduction of the T23 model, Bronkhorst High-Tech have expanded their IN-FLOWCTA series of Mass Flow Meters /Controller for industrial applications.
7th February 2014


Cavity formation technology allows for thinner camera modules

Cavity formation technology allows for thinner camera modules
Developed using a cavity formation technology, the commercialisation of a copper-core embedded-parts multilayer wiring substrate has been announced by TAIYO YUDEN. The substrate, “EOMIN”, utilised the cavity formation technology which enables the creation of a depression in a part of the substrate.
5th February 2014

Cabinets reduce extended storage space costs by 50%

Cabinets reduce extended storage space costs by 50%
Expanding the company’s range of ultra low humidity drying and storage cabinets, Totech Super Dry has launched the MSD Series of desiccant storage solutions. The cabinets feature very high performance dehumidification in a modular design that costs 50% less than conventional solutions.
4th February 2014

Picosun’s high performance 300-mm ALD cluster tool enters new generation memory market

Picosun reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications. The 300 mm cluster design is based on the company’s long-term top product, the fully automated, multifunctional PICOPLATFORM ALD deposition unit for parallel, simultaneous execution of several different processes for high-k and metal/metal nitride films.
9th April 2013

DEK Horizon 01iX Platform a Key Component of Krypton Solutions Expansion

DEK announces Krypton Solutions, has selected its Horizon 01iX print platform to enable expansion of the company’s electronics design and manufacturing business. The Plano, Texas-based firm, which specializes in full-service design, layout and rapid prototyping, is adding a fourth SMT production line to accommodate its growing customer base.
21st March 2013

HGST Reaches 10-Nanometer Patterned-Bit Milestone

HGST is leading the disk drive industry to the forefront in nanolithography, long the exclusive purview of semiconductor manufacturers, by creating and replicating minute features that will allow the doubling of hard disk drive (HDD) density in future disk drives.
4th March 2013

Infineon Completes 300-Millimeter Thin-Wafer Production Qualification

Infineon Technologies has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.
19th February 2013

FleX Silicon-on-Polymer Available With TowerJazz Foundry CMOS

American Semiconductor announces TowerJazz is the first foundry with a CMOS process, CS18, available for physically flexible wafers and ICs utilizing FleX Silicon-on-Polymer. This announcement was made at the 12th annual Flexible & Printed Electronics Conference presented by the FlexTech Alliance held in Phoenix, Arizona on January 29 - February 1, 2013.
31st January 2013


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