Amkor opens MEMS packaging line in China

2nd July 2016
Posted By : Peter Smith

Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology just announced it is opening a new MEMS and sensor packaging line at its facility in Shanghai. This new, state-of-the-art line will build on the expertise developed at Amkor’s MEMS packaging line in the Philippines, which has produced more than 2.1 billion units of MEMS and sensors since 2011.

“Because the package influences device performance, MEMS and sensor development requires close collaboration between device technologists and packaging engineers,” said John Donaghey, Amkor’s corporate vice president, Mainstream Products business unit. “Our Shanghai expansion allows us to better serve customers in Greater China and internationally.”

The sensor content of smartphones, Internet of Things devices, and smart automobiles is increasing rapidly. According to Yole Développement, this has spurred unit growth in the MEMS market to an expected 13% compound annual growth rate through 2021. Additionally, miniaturization and the need for advanced MEMS and sensors are driving the need for “sensor fusion”, which integrates more functionality into a single package. 

The new MEMS and sensor line in Shanghai uses Amkor’s standard strip-based processes, and offers leading-edge test protocols to speed time-to-market.

 


You must be logged in to comment

Write a comment

No comments




More from Amkor Technology

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Connected World Summit 2018
25th September 2018
United Kingdom Printworks, London
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry
Maintec 2018
6th November 2018
United Kingdom NEC, Birmingham
electronica 2018
13th November 2018
Germany Messe Munchen