Developed using a cavity formation technology, the commercialisation of a copper-core embedded-parts multilayer wiring substrate has been announced by TAIYO YUDEN. The substrate, “EOMIN”, utilised the cavity formation technology which enables the creation of a depression in a part of the substrate.
Designed for use in camera modules that are mounted in compact mobile devices, TAIYO YUDEN developed a cavity formation technology as a resolution to the high accurate flatness while retaining the characteristic noise immunity and high rigidity of the embedded-parts multilayer wiring substrate “EOMIN”. Thinner camera modules can therefore be realized by mounting an image sensor in the cavity.
By mounting an image sensor in the cavity, the overall module has been made thinner and more compact while retaining the characteristics of the embedded-parts multilayer wiring substrate “EOMIN”. This fulfills the demand of the advancing markets requirements for substrates to possess flatness and rigidity is ever increasing. Additional requirements are noise immunity needed to address less distortion and prevention of entry noise. These characteristics are critical to support high definition features and the narrowing of the pitch of pixels in camera modules with an increasing number of pixels.