E-beam lithography system to feature at Vienna show

19th September 2016
Posted By : Mick Elliott

The F7000 EB (electron beam) lithography system will be the centerepice of Advantest’s stand at the Micro and Nano Engineering Show in Vienna (September 19-23). The system delivers high throughput and creates very accurate and smooth nano-patterns on wafers from 1X-nm resolutions.

Its direct-write technology makes it well suited as a design tool for research and development as well as a solution for LSI production lines, where small-lot-multiple-type devices are produced.

Using character projection technology, the system offers high throughput for both prototyping and production.

Advantest’s portfolio of nanotechnology solutions also includes several other products. The E3310 and E3640 MVM-SEM systems enable real-time, 3D measuring and imaging of wafers and masks.

For tri-gate processes, the E3310 Wafer MVM-SEM offers high efficiency for volume production. The E3640 Mask MVM-SEM system delivers the industry’s best pattern-measurement capability and high throughput for applications including standard photomasks, EUV photomasks and NIL templates.

The E5610 Mask DR-SEM is designed for reviewing and classifying ultra-small defects in next-generation photomasks and blanks. The system offers highly stable, fully automatic image capturing with the long-term operational stability and reliability essential for manufacturing analyses of critical masks.


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