Photo Stencil has expanded its stencil manufacturing process with the addition of Laser Direct Imaging (LDI) capabilities. The new equipment enables Photo Stencil to transfer intricate patterns, fine lines, and small dots that are necessary for high density interconnects, BGAs, CSPs, and flex circuits, onto a substrate to create an extremely accurate stencil that can be used for solder paste printing of PCBs.
LDI delivers significantly better registration and positional accuracy and eliminates dimensional changes that can be caused by temperature and humidity. The greater depth of focus achieved enables imaging quality for high topography designs and uniform exposure of outer layers. The feature size, orientation and shape of the written pattern can be varied as needed, improving process yields. The LDI system ensures Photo Stencil can continue to service the most demanding and challenging applications in the industry.
Rachel Miller-Short, Vice President, Global Sales, Photo Stencil, comments: "Photo Stencil has pushed innovation to achieve stencils that accommodate high density interconnects and complex boards. We have developed electroform, NiCut and step stencils and continue to refine our capabilities and LDI is just a part of that. With our new LDI equipment we can provide stencils with even more accuracy, precision and custom solutions for applications."