Mühlbauer presents its 'Reel to Reel Flip Chip LED'

29th September 2015
Source: Mühlbauer
Posted By : Jordan Mulcare

At the LED professional Symposium 2015, Mühlbauer presented its latest development of 'Reel to Reel Flip Chip LED', a completely recent technology which allows the production of LED light engines directly on a flexible substrate. The light engine itself is manufactured by the latest Flip Chip technology. The system uses a high-volume Reel to Reel procedure, placing the flipped LEDs directly on the endless web material, i.e. onto the final design level 2 light engine.

The integrative process is based on a wafer-level packaging approach and consists of three basic steps: the bonding of LEDs (and other components like diodes, power control components and connectors); the dispensing of the lenses or phosphors; and the final test.

In general, the 'Reel to Reel Flip Chip LED' has several advantages over the current conventional technologies on the market. In the first place and most important, it saves up to 30% on the LED production costs. The cost savings are due to the now redundant gold wires, as well as to the significantly lower investment required by the production equipment.

In the second place, the production process is faster and easier to handle. With up to 20,000 units per hour the systems are achieving significantly higher production speeds. Due to the Reel to Reel procedure, a lot of the current subassembly steps can be omitted. The introduced technology is based on Flip Chip Reel to Reel, which has already been proven in Mühlbauer’s RFID division and is now adapted to LED applications according to customer requirements. In the RFID market, which is entering the high-volume phase right now, the leading topics are highest yield in combination with materials at competitive costs, thereby reflecting a similar situation to the LED market.


You must be logged in to comment

Write a comment

No comments




More from Mühlbauer

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

SPS IPC Drives 2018
27th November 2018
Germany Nuremberg
International Security Expo 2018
28th November 2018
United Kingdom London Olympia
The Security Event 2019
9th April 2019
United Kingdom NEC, Birmingham
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)