Nordson MARCH announces that its StratoSPHERE Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility.
The SPHERE plasma systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out.
The StratoSPHERE system's patented plasma chamber design delivers exceptional ashing uniformity and process repeatability. The system handles semiconductor wafers up to 300mm in diameter and supports automated handling and processing of round or square wafers. It can process thin wafers with or without a carrier, depending upon the wafer thickness.
"Nordson MARCH continues to enhance the SPHERE Series of plasma treatment systems to meet the demands of evolving semiconductor packaging like 2.5D and 3D fan-in and fan-out applications," said Jonathan Doan, Director of Marketing, Nordson MARCH. "The new StratoSPHERE configurations are more flexible in terms of chamber layout and location compared to other plasma systems on the market today. Our equipment is flexible and ideal for a variety of plasma treatment processes."
Nordson MARCH technical experts will be in booth #450 at SEMICON Taiwan 2015, in the TWTC Nangang Exhibition Hall, Taipei, Taiwan, 2nd to 4th September to discuss your applications.