Substrate & micro assembly at IMS 2017

4th May 2017
Source: NEO Tech
Posted By : Peter Smith

NEO Tech will showcase its high-reliability substrate and microelectronic assembly capabilities at the 2017 International Microwave Symposium - June 6-8 - at the Hawaii Convention Center in Honolulu.

During the symposium, NEO Tech will feature a range of its low-temperature co-fired ceramic (LTCC), high-temperature co-fired (HTCC), and microelectronics packaging technologies, including: Ceramic Substrate manufacturing: thick film, ECP thick film, BeO substrates, AlN systems, plating and HTCC/LTCC package assemblies; Extensive high-reliability microelectronics assembly technology including die attach, ceramic package wirebonding, COB laminates, device hermetic sealing and extensive product testing validation services;  and innovative AUTOLINE to economically produce complex RF microelectronic packages

Additionally, the company will discuss its high frequency millimeter and microwave microelectronics assembly experience, which include package assembly, sealing and testing. With more than 40 years of experience in high-reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembly services provider.


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