Photo Stencil, LLC, a provider of high-performance stencils and tooling, has announced that Susan Holmes, the company's Vice President of Engineering and Customer Service, will present her Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the Annual International Wafer-Level Packaging Conference during Session 10 on Wednesday 14th October.
The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA. Stencils are now being used for wafer bumping, wafer level ball placement, and mixed assembly of flip chip and SMT. The presentation will describe new methods of stencil printing, the types of stencils, configurations, and performance.
"Stencil design -- aperture size, stencil thickness, the stencil material, the smoothness of the apertures, spacing between apertures, and area ratio -- plays a major role in maximizing performance," explained Holmes. "The use of stencils is no longer confined to just the PCB industry or laser formed stencils. They now contribute significantly to the semiconductor assembly process and are made of new materials, in cleanrooms, and often using laser direct imaging."