Technology for thermoplastically deformable electronics

26th October 2015
Source: IMEC
Posted By : Nat Bowers
Technology for thermoplastically deformable electronics

At IMAPS 2015 this week, imec and CMST (imec’s associated lab at Ghent University) present a novel technology for thermoplastically deformable electronics which enables low-cost 2.5D free-form rigid electronic objects. The technology is under evaluation in Philips LED lamp carriers, a downlight luminaire and a omnidirectional lightsource, to demonstrate the potential of this technology in innovative lighting applications.

Thanks to its energy-efficiency, excellent light quality and high output power, LED technology is fast becoming the sustainable light source for the 21st century. But in addition, it also facilitates the design of unprecedented, innovative lighting solutions. Imec and CMST’s thermoplastically deformable electronic circuits now add a new dimension to the possibilities to fabricate novel lamp designs as well as smart applications in ambient intelligence and wearables.

The innovative technology is based on meander-shaped interconnects, a robust technique to realise dynamically stretchable elastic electronic circuits including LEDs. These are then embedded in thermoplastic polymers (e.g. polycarbonate). Following production on a flat substrate, using standard PCB production equipment, the circuit is given its final form using thermoforming techniques such as vacuum forming, high pressure forming or even injection molding. Upon cooling, the thermoplastic retains its shape without inducing large internal stresses in the circuits. The method, based on standard available production processes, does not require large investments, reducing the cost of fabrication. The resulting designs have a low weight and low complexity, a high resilience, a low tooling and material cost and a higher degree of manufacturer independence due to the standard industrial practices that are used.

The production process was developed in collaboration between the industrial and academic partners involved in the FP7 project TERASEL: imec, CMST (Ghent University), ACB, Holst Centre, Niebling Formtechnologie; Sintex NP; and Philips Lighting BV. TERASEL is a European effort focusing on the development, industrial implementation and application of large-area, cost-effective, randomly shaped electronics and sensor circuit technologies.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Connected World Summit 2018
25th September 2018
United Kingdom Printworks, London
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry
Maintec 2018
6th November 2018
United Kingdom NEC, Birmingham
electronica 2018
13th November 2018
Germany Messe Munchen