Displaying 11 - 20 of 70

Nordson ASYMTEK to present at CMMF China

Nordson ASYMTEK to present at CMMF China
ASYMTEK will present the paper Advanced Dispense Solutions for Hand-held Devices, at China Mobile Manufacture Forum (CMMF) - August 25. In addition, they will be exhibiting the latest in jet dispensing and conformal coating technologies at NEPCON South China (August 30-Sept 1).
17th August 2016

Saline Lectronics installs Stinger dispense module

Saline Lectronics installs Stinger dispense module
Saline Lectronics has recently installed the Stinger on its DEK Horizon 03iX printer used on a high-volume SMT Line. The Stinger is a low-volume dispense module that can be attached to the camera carriage of a standard DEK printer.
10th August 2016

Graco adds flow control and servo options

Graco adds flow control and servo options
Graco has announced that its PR70 Meter, Mix and Dispense Systems are now configurable with flow control and servo motor options, expanding their capacity to produce highly accurate and consistent beads in adhesive and sealant applications.
30th June 2016

Techcon Systems to fill up at the Farnborough Air Show

Techcon Systems to fill up at the Farnborough Air Show
Fluid dispensing systems and products specialist Techcon Systems is to exhibit at the Farnborough International Air Show (July 11-16) at the Show Centre in Farnborough, UK. Techcon will introduce its new Custom Filling Service, where Techcon can fill one part or multi-component liquid materials into just about any container, bag, tube, cartridge, syringe, or bottle.
21st June 2016

Good-bye air bubbles

Good-bye air bubbles
When manufacturing electronic components it is important to protect the workpieces against future external influences. Most manufacturers use potting or filling to do so. Especially for high-performance applications, vacuum dispensing is the method of choice. A high number of manufacturers are already using this highly efficient type of dispensing.
21st April 2016

Compact high speed jetter and dispenser

The new SPIDER from Essemtec AG  measures just 88 cm x 109 cm but features high speed jetting with up to 150,000 dots per hour. According to the company, technically sophisticated 3D dispensing applications, a wide range of processes such as solder paste jetting and flip-chip underfill can be performed.
19th April 2016

New hot melt jet valve at NEPCON China

 Techcon Systems will launch its new TS9300HM Hot Melt Jet Valve at NEPCON China. The TS5624 Disposable Path Material Diaphragm Valve dispenses low to medium viscosity fluids over a wide range of shot and bead sizes, down to a fraction of a micro litre.
12th April 2016

Techcon launches hot melt jet valve and controller

Techcon launches hot melt jet valve and  controller
Techcon Systems has launched the TS9300HM Series PUR Hot Melt Jet valve and TS930 Controller. The valve and controller are specially designed for high-temperature operation. The TS9300HM Series features patented diaphragm technology and is easy-to-use and clean.
2nd March 2016

Formed In-Place Technology at Chinaplas 2016

Sonderhoff will exhibit at Chinaplas 2016 and will demonstrate live the advantages of  Formed In-Place (FIP) dispensing technology by means of its low pressure mixing and dosing system DM 402/403. 
1st March 2016

New syringe assembly from Techcon

Techcon Systems, a product group of OK International, has announced the availability of a 1ml manual syringe assembly designated MSA401L-1. It consists of a barrel, a plunger and a piston all fully assembled without any lubrication. 
7th January 2016

Dispensing documents

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