CXP oven ready for SMT Hybrid Packaging show

17th April 2014
Posted By : Mick Elliott
CXP oven ready for SMT Hybrid Packaging show

Microtronic will highlight the new Akrometrix CXP (Convection Expandable Platform) on its stand (9-430A) at the SMT Hybrid Packaging exhibition in Nuremberg, Germany (May 6-8, 2014). It is a low-cost, standalone system primarily targeted at the EMS and PCB fab market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48 mm with a measurement resolution of 5 μm. The CXP uses the same Studio software used to run the Akrometrix TherMoiré platforms.

It uses a convection oven for heating and cooling and includes a 2MP camera and projector for DFP measurements. The CXP oven can hold samples up to 300x300 mm in size and the 64x48 mm field of view is movable around the full oven 300x300 mm field of view through a sliding gantry.

Microtronic’s LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current industry challenges. The system is operated by using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

It can also can measure using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.


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