Events

Displaying 1 - 10 of 451

Look further, go beyond at SMTconnect

Look further, go beyond at SMTconnect
Trade fair for the electronics industry, SMTconnect (formerly SMT Hybrid Packaging), will be opening its doors in Nuremberg from 7th to 9th May. Rehm Thermal Systems has announced that it will be attending again this year, and will be found in Hall 4A, at Stand 100.
16th April 2019

PXI matrix modules showcased at SMTConnect 2019

PXI matrix modules showcased at SMTConnect 2019
SMT Connect 2019 will provide the platform for Pickering Interfaces to show its modular signal switching and simulation solutions for use in electronic test and verification. These include the Model 40-559 BRIC Ultra-High-Density Large PXI Matrix Modules. This range of large PXI matrices are robust 1A/20W switching modules, with up to 4,096 crosspoints.
15th April 2019

Electrically conductive adhesives at Intersolar Europe

Electrically conductive adhesives at Intersolar Europe
Global supplier of conductive interconnect materials, Engineered Material Systems, will exhibit in Hall C1, booth 354 at the Intersolar Europa Solar Power Expo, scheduled to take place May 15th to 17th, 2019 in Munich, Germany. Company representatives will show next-generation low-cost electrically conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules.
12th April 2019


Electrolube launch next-gen UV cure coatings at SMTConnect

Electrolube launch next-gen UV cure coatings at SMTConnect
Seven next generation UV cure conformal coating products have been launched and will be on show for the first time in Europe at the SMTConnect show In Nuremberg from 7th-9th May 2019. Electrolube, the global manufacturer of electro-chemicals, developed the new UVCL range to meet the various requirements of electronics, LED and automotive manufacturers, with the additional benefit of rapidly increasing production time and offering even higher levels of performance. The new UV Cure range will be showcased in Hall 4, stand 339, where Electrolube’s senior technical team will be available to discuss the advantages and specifications of the new UV cure coating range.
3rd April 2019

Keynote speakers announced for VOICE 2019

The technical program and complete list of keynote speakers for both locations of Advantest’s VOICE 2019 Developer Conference have been finalised. For the first time, the conference will be held in Scottsdale, Arizona (May 14-15) and Singapore (May 23) under the unifying theme "Measure the Connected World and Everything in It.”
3rd April 2019

Silicon test solution set for DATE in Florence

Semiconductor test equipment supplier Advantest will showcase its CloudTesting Services (CTS) at DATE 2019 in Florence (March 26-28). The annual conference combines a world-class technical program with an international exhibition of electronic design automation and test technologies.
21st March 2019

Looking ahead to LOPEC 2019

Looking ahead to LOPEC 2019
With its three-day Conference, LOPEC, the international exhibition for printed electronics, is bridging the gap between science and industry. From 19th-21st March 2019, manufacturers, users and researchers from all over the world will meet in Munich to discuss innovations and trends in printed electronics.
18th March 2019

Experience printed electronics live at LOPEC 2019

Experience printed electronics live at LOPEC 2019
This year's LOPEC show will take place in Munich from 19th to 21st March. Visitors can expect a supporting programme at the International Exhibition and Conference for the Printed Electronics Industry. Among the crowd-pullers are the Demo Line, which brings the manufacturing process of printed electronics to life, and the Innovation Showcase with developments from a wide range of industry sectors, from aviation to the textile industry.
14th March 2019

SEMICON China to feature AI test solution

Semiconductor test equipment supplier Advantest will demonstrate and present a technical paper on its V93000 artificial intelligence (AI) test solution for the diverse and fast-growing AI and high-performance computing markets during SEMICON China in Shanghai (March 20-22) The V93000 Single Scalable Platform is already in widespread use at major AI chip designers around the world including China’s leading AI fabless companies.
11th March 2019

Take off with printed electronics at LOPEC 2019

Take off with printed electronics at LOPEC 2019
Low weight, no need for cables and highly automated manufacturing of fully customised components; printed electronics offers many advantages for the aviation industry. At the LOPEC Conference 2019, Dennis Hahn from Airbus and Max Seissler from the consulting and technology company Altran will provide an overview of the special requirements placed on flying components. 
18th February 2019


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IoT Tech Expo 2019
25th April 2019
United Kingdom Olympia, London
Ceramics Expo 2019
29th April 2019
United States of America International Exposition Center (I-X Center)
PCIM 2019
7th May 2019
Germany Nürnberg Messe
Electronics & Applications 2019
14th May 2019
Netherlands Jaarbeurs Utrecht Hall 7 Jaarbeursplein
Agile for Automotive 2019
15th May 2019
United States of America Detroit, MI