Events

Displaying 1 - 10 of 454

In-mold electronics specialists converge for IMSE days 2.0

In-mold electronics specialists converge for IMSE days 2.0
Injection molded structural electronics (IMSE) technology specialist, TactoTek, with support from Platinum sponsor MacDermid Performance Solutions, Silver sponsors, Altium and Niebling, and presenters from across the in-mold electronics ecosystem will convene the IMSE Days 2.0 conference on June 5th, 2019 in Oulu, Finland. 
16th May 2019

The power of advancing polymers to parts

The power of advancing polymers to parts
Celebrating the invention of PEEK polymer 40 years ago, Victrex will be at OTC 2019 in Houston (Booth #505) to emphasise how it has developed its polymers to final parts product range. Today´s list of VICTREX PAEK and PEEK-based innovations covers polymers, films, fibres, pipes, composite and gear solutions.
3rd May 2019

5G test services to feature at Kuala Lumpur show

Products and services enabling the development of 5G technology will be featured by Advantest at SEMICON Southeast Asia in Kuala Lumpur (May 7-9). Live product demonstrations and digital graphics will showcase its IC test solutions.
2nd May 2019


Look further, go beyond at SMTconnect

Look further, go beyond at SMTconnect
Trade fair for the electronics industry, SMTconnect (formerly SMT Hybrid Packaging), will be opening its doors in Nuremberg from 7th to 9th May. Rehm Thermal Systems has announced that it will be attending again this year, and will be found in Hall 4A, at Stand 100.
16th April 2019

PXI matrix modules showcased at SMTConnect 2019

PXI matrix modules showcased at SMTConnect 2019
SMT Connect 2019 will provide the platform for Pickering Interfaces to show its modular signal switching and simulation solutions for use in electronic test and verification. These include the Model 40-559 BRIC Ultra-High-Density Large PXI Matrix Modules. This range of large PXI matrices are robust 1A/20W switching modules, with up to 4,096 crosspoints.
15th April 2019

Electrically conductive adhesives at Intersolar Europe

Electrically conductive adhesives at Intersolar Europe
Global supplier of conductive interconnect materials, Engineered Material Systems, will exhibit in Hall C1, booth 354 at the Intersolar Europa Solar Power Expo, scheduled to take place May 15th to 17th, 2019 in Munich, Germany. Company representatives will show next-generation low-cost electrically conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules.
12th April 2019

Electrolube launch next-gen UV cure coatings at SMTConnect

Electrolube launch next-gen UV cure coatings at SMTConnect
Seven next generation UV cure conformal coating products have been launched and will be on show for the first time in Europe at the SMTConnect show In Nuremberg from 7th-9th May 2019. Electrolube, the global manufacturer of electro-chemicals, developed the new UVCL range to meet the various requirements of electronics, LED and automotive manufacturers, with the additional benefit of rapidly increasing production time and offering even higher levels of performance. The new UV Cure range will be showcased in Hall 4, stand 339, where Electrolube’s senior technical team will be available to discuss the advantages and specifications of the new UV cure coating range.
3rd April 2019

Keynote speakers announced for VOICE 2019

The technical program and complete list of keynote speakers for both locations of Advantest’s VOICE 2019 Developer Conference have been finalised. For the first time, the conference will be held in Scottsdale, Arizona (May 14-15) and Singapore (May 23) under the unifying theme "Measure the Connected World and Everything in It.”
3rd April 2019

Silicon test solution set for DATE in Florence

Semiconductor test equipment supplier Advantest will showcase its CloudTesting Services (CTS) at DATE 2019 in Florence (March 26-28). The annual conference combines a world-class technical program with an international exhibition of electronic design automation and test technologies.
21st March 2019

Looking ahead to LOPEC 2019

Looking ahead to LOPEC 2019
With its three-day Conference, LOPEC, the international exhibition for printed electronics, is bridging the gap between science and industry. From 19th-21st March 2019, manufacturers, users and researchers from all over the world will meet in Munich to discuss innovations and trends in printed electronics.
18th March 2019


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IFSEC 2019
18th June 2019
United Kingdom EXCEL, London
Sensor+Test 2019
25th June 2019
Germany Nürnberg Messe
The Digital Healthcare Show 2019
26th June 2019
United Kingdom EXCEL, London
unbound london 2019
17th July 2019
United Kingdom Old Truman Brewery, London
DSEI 2019
10th September 2019
United Kingdom EXCEL, London