Akrometrix will exhibit in Booth #134 at SMTA International, 29th to 30th September 2015 at the Donald Stephens Convention Center in Illinois, USA. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Surface-mount components may warp during the reflow process, as well as the associated land area. This warpage between components and the land area can contribute to defects such as Head-on-Pillow, shorts and opens. Fully understanding the critical interface between surfaces is more important than ever.
The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analysed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.