Nihon Superior celebrates 50th anniversary at SMTAI

16th September 2015
Posted By : Jordan Mulcare
Nihon Superior celebrates 50th anniversary at SMTAI

Nihon Superior will exhibit in Booth 419 at SMTA International, scheduled to take place from 27th September to 1st October, 2015 at the Donald Stephens Convention Centre in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in a wide range of electronics assembly products.

The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

During the show, the company will showcase newly developed products that offer solutions for some of the challenges the electronics industry is now facing, such as improvements in reliability, thermally stable joining and lead-free die attach.

SN100CV P506 D4 is a lead-free, no-clean solder paste with its basic composition of (Sn-Cu-Ni-Ge). This new alloy has an addition that enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The unique ability of SN100CVP506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes. The long open time ensures trouble-free performance in production processes.

Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces make it possible to achieve strong bonds with high electrical and thermal conductivity at low temperatures without the need for external pressure.


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