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PCB inspection system to make debut at SMTAI 2014

27th August 2014
Staff Reporter
0

The FX-940 AOI In-line PCB inspection system, from Nordson YESTECH, will make its debut at SMTA International 2014. Scheduled to take place between September 30th and October 1st, 2014 at the Donald Stephens Convention Center in Rosemont, IL, visitors can find the system on display in Booth #606.

The FX-940 offers multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices. The system offers advanced Fusion Lighting and a comprehensive set of inspection tools for defect detection. The inspection tools include angled cameras, 3D height sensors, full color digital image processing, and both image- and rule-based algorithms.

The company's “capture-on-the-fly” imaging technology is used to provide high-speed inspection at over 30 sq. inches per second, or greater than 1.5 million components per hour. With one top-down viewing camera and four side-viewing cameras, the FX-940 provides full inspection and traceability capabilities at fast line speeds. Off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield management solution.

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