Solder alloy fabrications to be showcased at NEPCON China

20th June 2017
Posted By : Lanna Cooper
Solder alloy fabrications to be showcased at NEPCON China

 

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at NEPCON South China 2017 29th-31th August in Shenzhen, China.

Indium Corporation is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved. 

When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:

  • Four improved thermal cycling reliability compared to a solder preform-only approach
  • Two improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
  • Reduced voiding (<1%)
  • Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment

Click here for more information about InFORMS.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Medical Japan 2018
21st February 2018
Japan INTEX Osaka
Mobile World Congress 2018
26th February 2018
Spain Barcelona
embedded world 2018
27th February 2018
Germany Nuremberg
Industry 4.0 Summit 2018
28th February 2018
United Kingdom Manchester
Factories of the Future Expo 2018
28th February 2018
United Kingdom Manchester