Solder pastes address improvements in reliability

10th January 2017
Posted By : Anna Flockett
Solder pastes address improvements in reliability

Exhibiting in Booth 2610, Nihon Superior will be at the 2017 IPC APEX EXPO, taking place 14th-16th February at the San Diego Convention Center in California. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products.

The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

During the show, the company will showcase a newly developed product that offers solutions for some of the challenges the electronics industry is now facing, such as improvements in reliability and thermally stable joining.

SN100CV P506 D4 is a lead-free, no-clean solder paste with a basic composition of (Sn-Cu-Ni+Ge+Bi). This new alloy has an addition that enables thermally stable solder joints even after thermal cycling.

Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint.

The ability of SN100CVP506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes.


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