Soldering system takes centre stage at productronica

7th November 2019
Posted By : Mick Elliott
Soldering system takes centre stage at productronica

With many of its pre-eminent suppliers exhibiting at productronica in Munich (November 12-15), Altus Group, will be supporting their partners by introducing customers to the latest innovations, including Rehm Thermal Systems’ bespoke solutions and systems.

Rehm will be demonstrating its latest systems including VisionXP+. This convection soldering system offers high quality and flexibility with an outstanding throughput rate.

On the Rehm stand they will be presenting highlights of the continuing development of the VisionXP+.

These include the EC fan motors that make the system both quieter and more sustainable, and a new chamber design which reduces N2 consumption.

There is also a newly developed cooling line and a number of software analysis tools.

Also on the Rehm stand will be CondensoXS smart which features a process chamber delivering the highest process reliability within a small footprint.

The new chamber design ensures the optimum hermetical seal ensuing reliable and reproducible results. This modified opening mechanism has greatly improved both the dependability and the service life of the system.


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