Representatives from FCT Assembly plan to exhibit the company's NanoSlic stencil coating and its solder pastes at the 2014 SMTA Philadelphia and SMTA West Penn Expos. The former is scheduled to take place on the 12th of August, at the Crowne Plaza Philadelphia in Cherry Hill, New Jersey, and the latter on the 14th of August, at the Doubletree Hotel in Monroeville.
The NanoSlic stencil was developed to address the increasing demands confronting the electronic assembly industry. It enables higher yields and less rework by improving solder paste transfer efficiencies for small apertures. The stencil also minimises bridging and reduces underside cleaning. As well as this, the technology can be easily evaluated and is compatible with current assembly equipment and processes.
FCT's solder pastes are formulated to solve various issues during the assembly process, including anti-tombstoning, low graping, low voiding, low melting, high activity, etc. Representatives will be available at the Expos to discuss solutions that the company can offer by leveraging its team’s vast knowledge and expertise in solder and stencils.