Inspection & Test

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productronica sees launch of In-Circuit tester

productronica sees launch of In-Circuit tester
The i3070 series 6 In-Circuit Test (ICT) suite of solutions which enables electronics manufacturers to improve test throughput and the operational efficiency of their printed circuit board assembly (PCBA) manufacturing was unveiled by Keysight Technologies at productronica in Munich today (November 12).
12th November 2019

Testing the upper use temperature of perfluoroelastomers

Testing the upper use temperature of perfluoroelastomers
The market for industrial-use elastomers is defined by extremes. Whether chemical compatibility, plasma resistance, high and low temperatures, or other characteristics, engineers demand the highest possible performance. By Dr Thomas Reger, Senior Scientist at Greene, Tweed
7th November 2019

X-ray inspection machine debuts at productronica

X-ray inspection machine debuts at productronica
A compact, lightweight, inline 3D-CT automated X-ray inspection machine, the 3Xi-M110, for inspection of printed circuit board assemblies (PCBAs) will be demonstrated at productronica in Munich (November 12-15) by Saki Corporation. The 3Xi-M110 reduces the dose and exposure to X-rays during inspection and features new soldering quality inspection functions for PCB assembly applications.
1st November 2019


Rohde & Schwarz prepares productronica push

Rohde & Schwarz prepares productronica push
productronica is a home fixture for Munich-based Rohde & Schwarz and the company will field an array of solutions covering Industry 4.0, test and measurement for production and development, and automatic production test systems.
24th October 2019

RF tests integrated into production lines

RF tests integrated into production lines
A test handler from 6TL Engineering is said to be the first system on the market integrating RF tests into production lines. In addition, its modular approach offers the possibility of adding more test stations into a production line to work coordinated and in parallel to reduce test cycle times.
21st October 2019

Two modules and a test head enhance SoC test platform

Two modules and a test head enhance SoC test platform
Two new modules and a test head designed specifically for high-volume testing of devices used in automotive applications have been added to Advantest’s T2000 platform. The new equipment is designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles, a market segment that is projected to have a 9.6% compound annual growth rate from 2019 to 2022.
15th October 2019

Inspection system comes with guaranteed MES connection

Inspection system comes with guaranteed MES connection
The connection to Manufacturing Execution Systems (MES) plays a central role in electronics manufacturing for efficient production control and as a data basis for recording and evaluating relevant data. Despite many efforts, no MES has been able to establish itself as a standard today, which means that a large number of systems exist.
11th September 2019

3D-view microscope dispenses with screens and goggles

3D-view microscope dispenses with screens and goggles
Described as a flagship product, the Deep Reality Viewer (DRV-Z1) microscope has been unveiled by Vision Engineering. Designed at its Woking, UK HQ, the DRV-Z1 enables the user to view high definition 3D images under magnification without using a flat screen, or requiring operators to wear goggles or specialist glasses.
20th August 2019

Ethernet controller features faster test clock

Ethernet controller features faster test clock
Because of its expanded internal memory, a new Ethernet controller for ASSET InterTech’s ScanWorks platform can program larger data images and process test operations faster. The Remote Instrumentation Controller, designated the RIC-1400, is a direct replacement for the RIC-1000
8th August 2019

3D inspections now cover solder paste

3D inspections now cover solder paste
The 3D AOI systems Basic Line · 3D and Vario Line · 3D from GÖPEL electronic can now also perform a complete solder paste inspection as well as placement control before the soldering process. In addition to the 3D/2D inspection tasks, the systems become even more flexible.
29th July 2019


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