Inspection & Test

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Contactor combines advanced test features at high temperatures

Contactor combines advanced test features at high temperatures
cDragon from Cohu combines advanced test features at temperatures from -55 °C to +155 °C with best RF capabilities and an innovative pin design for highest test yield and low cost of ownership. The closed-loop Intelligent Contactor Option controls the required conditions for the device under test (DUT).
8th January 2019

Innovation pressure vs in-circuit test

Innovation pressure vs in-circuit test
If a product is improved or obsolete components have to be replaced, these changes will affect every process in electronics manufacturing. From solder paste printing to assembly, inspection, and testing, none of these steps will remain unchanged for long. In-circuit testing (ICT) is often a major challenge for redesigns.
11th December 2018

Platform opens two routes to DDR4 testing

Platform opens two routes to DDR4 testing
Engineers designing with Double Data Rate 4 (DDR4) memory devices can quickly deploy tests for shorts and opens on control, address and data lines with the boundary scan test (BST) tools of ASSET InterTech’s ScanWorks platform for fast test and programming.
5th December 2018


Experiment confirms high-speed potential of STT-MRAM

Experiment confirms high-speed potential of STT-MRAM
A collaboration between Advantest and Tohoku University’s Center for Innovative Integrated Electronic Systems led by Tetsuo Endoh has successfully demonstrated operation of a high-writing-speed spin-transfer torque magnetic random access memory (STT-MRAM) using an Advantest memory test system.
5th December 2018

Photomask measurement tool increases throughput

Photomask measurement tool increases throughput
A tool that measures fine pattern dimensions on photomasks with higher precision and stability has been launched by Advantest. The E 3650 MASK MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) uses the company’s proprietary technology.
29th November 2018

Memory tester meets 5G chip needs

The T5851 STM16G memory tester from Advantest is for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
27th November 2018

Module extends tester's range to high-voltage semiconductors

Module extends tester's range to high-voltage semiconductors
A module for its EVA100 measurement system that enables testing of high-power ICs used in large-volume consumer applications has been introduced by Advantest. With the new HVI (high-voltage VI source and measurement) module, chip makers can ensure the reliability of power devices in widely used applications such as AC/DC and DC/DC converters, motor controllers, LED drivers and gate drivers by accurately measuring their current leakage and breakdown voltages.
13th November 2018

Keysight and Cohu to work on 5G chips test solution

A collaboration between Keysight Technologies and Cohu, has been extended to deliver enhanced high volume manufacturing (HVM) solutions for the 5G semiconductor manufacturing test market. Integrating Keysight's 5G NR Signal Studio and PXI modular instruments with Cohu's HVM radio frequency (RF) test tools enables 5G semiconductor manufacturers to streamline the transition from device validation testing (DVT) to HVM.
7th November 2018

Parametric tester meets 28nm to 3nm process node needs

Leading semiconductor test equipment supplier Advantest has released its V93000 SMU8 parametric tester to meet chip makers’ process-characterisation and monitoring needs for the exacting measurements required on the 28nm to 3nm process nodes and beyond.
30th October 2018

JTAG to celebrate 25th anniversary at electronica

JTAG to celebrate 25th anniversary at electronica
The electronica exhibition in Munich (November 13-16) will see JTAG Technologies will celebrate 25 years of developing, supplying and supporting world-class board (PCBA) test and programming solutions based on IEEE Std 1149.x . During this period there have been a great many technological advancements within niche areas of board test and programming and in Aerospace, Automotive, Defence, Telecoms and Datacoms where many of the company’s customers operate.
26th October 2018


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LOPEC 2019
19th March 2019
Germany Messe Munchen