12.8Gbps instrument tests leading-edge SerDes ports

9th August 2018
Source: Xcerra
Posted By : Mick Elliott
12.8Gbps instrument tests leading-edge SerDes ports

The Xcerra HSI1x instrument from Xcerra for the well-established Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8Gbps data rate. The instrument can be used for protocol and physical layer testing of leading edge SerDes ports, such as MIPI, PCIexpress, VbyOne, HDMI and USB, found on the latest applications processors, flat panel display devices, and other high performance ICs.

The latest application processor and related ICs require greater than 6.4Gbps and have increased lane counts.

Furthermore, many ports are mixed-mode, requiring both embedded clock and forwarded clock operation.

With 32 transmit and 24 receive lanes per instrument running at up to 12.8Gbps data rate, HSI1x provides the highest channel density and cost-effectiveness in the ATE industry allowing for high multi-site full-functional testing resulting in the lowest cost of test.

HSI1x builds on the established Diamondx HSIO instrument and enhances the capabilities to meet the advanced test requirements.

The HSI1x has 3.5 times the lane count and twice the data rate of the HSIO instrument, and adds programmable lane-lane timing alignment.

It features true parallel clock-data recovery and bit-error-rate testing, built-in PRBS pattern generation, deep user-programmable pattern memory, and flexible jitter and equalisation settings.

Christopher Lemoine, Product Marketing Director, comments: “Xcerra has long legacy of leading-edge SerDes solutions. Working closely with our customers, we have developed this new instrument to support the test needs of next generation applications processors, flat panel display drivers, display timing controllers, and other high data rate devices, with cost effectiveness that is unmatched in the ATE industry. Combined with the ground-breaking efficiency and scalability of the Diamondx platform, the HSI1x is a compelling solution for the latest mobility, consumer and automotive devices.”

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