Inspection & Test

Displaying 11 - 20 of 345

Wireless test set gets thumbs-up for IoT chip tests

Wireless test set gets thumbs-up for IoT chip tests
Huawei has endorsed Anritsu’s MT8870A high-speed wireless test platform for its RF calibration and validation tests. The Test Set provides support for the Hi2110 and Hi2115 NB-IoT chipsets designed for IoT use cases. Anritsu’s MT88xx series long-established connectivity and cellular test methodologies provide Huawei with improve product quality and manufacturing efficiency.
20th March 2018

Silicon validation alternative ready for Dresden DATE

CloudTesting Services (CTS) will be showcased by Advantest at DATE 2018, the European event for electronic systems design and test in Dresden (March 19-23). The CTS test solution offers the latest high-quality test methods utilising on-demand IPs, characterisation tools, analysis and more.
19th March 2018

est module boosts accuracy, enhances output

est module boosts accuracy, enhances output
The next generation of its 6DOF gyro test module for singulated packages has been released by Multitest. It provides significant production benefits resulting in even lower cost of test, enhanced test accuracy and higher daily output. The module has been optimised for operational cost, uptime and stimulus clearness and accuracy.
14th March 2018


Observing ultrafast processes with attosecond resolution

Observing ultrafast processes with attosecond resolution
Many chemical processes run so fast that they are only roughly understood. To clarify these processes, a team from the Technical University of Munich (TUM) has now developed a methodology with a resolution of quintillionths of a second. The new technology stands to help better understand processes like photosynthesis and develop faster computer chips. An important intermediary step in many chemical processes is ionisation.
20th February 2018

Electronic load boasts voltage accuracy of 0.1%

The EA Elektro Automatik EL 3000 B Series for automated testing in workshops, laboratories, education, R&D and industry is in stock at Farnell element14. This series is an ideal bench-top tool for low-power component- and device testing, providing accurate and reproducible test data.
13th February 2018

Source measure unit enhances semiconductor testing

Source measure unit enhances semiconductor testing
Endeavouring to offer more efficient approaches to semiconductor test, NI has announced the PXIe-4163 high-density source measure unit (SMU), which provides six times more DC channel density than previous NI PXI SMUs for testing RF, MEMS, and mixed-signal and other analogue semiconductor components.
6th February 2018

Parametric test solution cuts time to market

Parametric test solution cuts time to market
The third generation of its P9000 series massively parallel parametric test system has been released by Keysight Technologies. The system accelerates the fast ramp of new technology and reduces the cost-of-test in the development and manufacturing of advanced semiconductor logic and memory ICs.
10th January 2018

Boundary scan test extended to PSoC 4 controllers

Boundary scan test extended to PSoC 4 controllers
The VarioTAP model range has been extended by Goepel to include Cypress PSoC 4 controllers. The VarioTAP model libraries allow a complete fusion of Boundary Scan test and JTAG emulation. The processor is controlled via the native debug port, allowing users to perform hardware design validation and prototype testing without firmware.
9th January 2018

Stimulus test cell accelerates sensor testing

Stimulus test cell accelerates sensor testing
The HA7300 stimulus test cell announced by Advantest is a full capability solution for the testing of differential pressure sensors which are becoming pervasive in modern automobile designs focused on better fuel economy and green technologies. The HA7300 delivers high-speed, highly precise test temperature control with a proprietary technology that utilises a heat or cold plate to control the temperature of the sensors under test.
8th December 2017

Probe heads offer wafer level chip test alternative

Probe heads offer wafer level chip test alternative
The Volta Series probe heads from Smiths Interconnect are optimised for wafer-level chip-scale package testing. As phones and smart devices get more powerful, so do the integrated chips that support them. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers.
8th December 2017


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Startups Magazine Launch Party: Financing a Startup
24th July 2018
United Kingdom WeWork Waterhouse Square, London
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry
Maintec 2018
6th November 2018
United Kingdom NEC, Birmingham