Inspection & Test

Displaying 291 - 300 of 332

Test chips allow pre-production thermal engineering

Test chips allow pre-production thermal engineering
Thermal Test Chips (TTCs) designed by JVD can be used to save time and money in the design and thermal management of ASICs and ASSPs, by allowing thermal engineering of components prior to investment in the expensive silicon required for production. With smaller, more powerful, faster devices thermal management is an ever-increasing concern for designers.
19th November 2014

Sophisticated X-ray ensures hassle-free PCBA inspection

Sophisticated X-ray ensures hassle-free PCBA inspection
Subcontract manufacturers of PCBAs generally use a number of different tools for quality control, such as flying probe testers, camera-based automated optical inspection and X-ray equipment. Very few UK manufacturers can boast such sophisticated X-ray inspection capability as Newbury Electronics, following the company’s purchase of a Nikon Metrology XT V160 in January 2014.
18th November 2014

Benefits of AOI to be discussed at Technology Event

ViTrox Technologies will participate in Etek’s Technology Event, scheduled to take place from 5th to 6th November 2014 in Prestwick, Scotland. Tan Piet Gek, Senior Engineer & Technical Support (PCA-AOI), will present 'AOI PCBA Inspection'.
6th November 2014


Extended x-ray inspection range caters for larger assemblies

Extended x-ray inspection range caters for larger assemblies
Viscom has extended its portfolio in the x-ray inspection range with a flexible inspection system. The X8068 universal x-ray inspection system unites the high inspection quality and technology of the Viscom x-ray systems with an extended inspection scope for larger electronic assemblies. With this solution, electronics manufacturers could not be better equipped as far as both test piece size and application are concerned.
6th November 2014

X-Ray metrology tool claimed to be faster & more precise

X-Ray metrology tool claimed to be faster & more precise
  Nordson DAGE has announced its most recent order from a major customer in the semiconductor industry for its XM8000 wafer X-ray metrology tool. It will be used for the automatic measurement of wafer bumps and Through Silicon Vias (TSVs) using 2D and 3D x-ray inspection methods.
5th November 2014

SPI's angle cameras measure solder paste deposit

SPI's angle cameras measure solder paste deposit
Vi Technology's Pi SPI system offers the customer an immersive print process experience, with unparallelled vision and measurement capabilities. According to Vi, the Pi system is the first SPI to use angle cameras, in conjunction with 360° Moiré technology, to measure the solder paste deposit.
28th October 2014

CyberOptics brings SPI & AOI to Matelec

CyberOptics brings SPI & AOI to Matelec
CyberOptics will exhibit with its representative, Accelonix Iberica, in Booth 4D04 at Matelec 2014, scheduled to take place 28th-31st October at Ifema - Parque Ferial Juan Carlos I in Madrid, Spain. CyberOptics’ flagship 3D SPI system, the SE600, and high-performance QX600 AOI system will be demonstrated at the show.
22nd October 2014

Test company takes JTAG tools to Seattle

Test company takes JTAG tools to Seattle
Eindhoven-based JTAG Technologies will travel to the International Test Convention in Seattle (Oct 21-23) to showcase a range of products and some new system upgrades. Newly available as an addition to its standard range of tools, is a module aimed at the support of new IEEE P1687 (aka IJTAG – Internal JTAG) compliant devices. 
16th October 2014

Modular design enhances test bench

Modular design enhances test bench
Lian-Li Industrial has unveiled the brushed aluminum PC-T80 DIY Test bench. An update of the PC-T60, the PC-T80 has added native radiator support and a more modular design. With dimensions of 440mm x 435mm x 335mm (17.3in x 17.1in x 13.1in) WxHxD, the test bench is separated into three zones, allowing for easy configuration and updates of hardware.
16th October 2014

electronica 2014: Thermal imaging solution makes debut

electronica 2014: Thermal imaging solution makes debut
Canada-based Acculogic travel to electronica armed with an array of test equipment. Pride of place goes to the the FLS980 Series III with the Ultimate Accuracy Package Option along with high-throughput features such as the latest version Flying Bed of Nails (FBON). The new ThermoScan thermal imaging test solution and MircoScan miniature image observation and testing solutions will be unveiled at the show for the first time.
15th October 2014


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