Inspection & Test

Displaying 321 - 330 of 338

GN Resound selects MEK as AOI and SPI supplier

GN Resound selects MEK as AOI and SPI supplier
An electronics manufacturer has been announced as the AOI and SPI manufacturer of choice by GN Resound. Mek's PowerSpector FDAz 350L AOI system and S1 SPI system were chosen by GN Resound to manufacture it's components. GN Resound required cameras that were easy to set up, fast to use, with components and software that were upgradable. 
7th July 2014

Even faster inspection with TurboLine

Even faster inspection with TurboLine
Earlier this year, GOEPEL electronics announced a significant increase in testing speed for the high-end AOI system TurboLine. Innovative solutions of image capturing technology and test program execution in combination with massive use of angled-view inspection could reduce the test time up to 50%.
27th June 2014

FastFlow – The New High-Speed Handling for Viscom AOI

FastFlow – The New High-Speed Handling for Viscom AOI
In modern electronics manufacturing, short cycle times with no quality loss plays a critical role in increasing productivity. The new FastFlow concept from Viscom takes this demand into account. The high-speed transport optimizes throughput and shortens cycle time.
26th June 2014


Xenics Bobcat-640: Smallest SWIR Low Noise CL/GigE Camera Now in Production

Xenics Bobcat-640: Smallest SWIR Low Noise CL/GigE Camera Now in Production
Xenics has released its Bobcat-640 to full-qualification production.
19th June 2014

Transport optimises throughput & shortens cycle time

Transport optimises throughput & shortens cycle time
In modern electronics manufacturing, short cycle times with no quality loss plays a critical role in increasing productivity. The FastFlow concept from Viscom takes this demand into account. The high-speed transport optimizes throughput and shortens cycle time.
18th June 2014

Mek demo total process inspection coverage at SMT

Mek demo total process inspection coverage at SMT
At this year's SMT Hybrid Packaging, May 6-8 in Nuremberg, Germany, Mek will exhibit a line-up of high performance AOI systems for total process inspection coverage. Showcase products include the SpectorBOX “Bottom-Up” Modular AOI system specifically engineered for wave and selective solder THT and SMT manufacturing.
29th April 2014

Nordson demo X-ray and AOI systems at NEPCON China

Nordson demo X-ray and AOI systems at NEPCON China
At NEPCON China, April 23-25, 2014 in Shanghai, Nordson DAGE and Nordson YESTECH will exhibit X-ray and AOI systems in Booth # B-1F25. Featured at the show, the Nordson DAGE XD7600NT Diamond FP X-ray inspection system with QuickView CT utilises the latest technology to provide the ultimate choice for the highest quality in X-ray imaging on the market.
23rd April 2014

Jaltek selects MIRTEC's 2D/3D in-line AOI system

Jaltek selects MIRTEC's 2D/3D in-line AOI system
Meeting the company's demand for the very latest in state-of-the-art 2D/3D inspection technology at an affordable price point, Jaltek Systems has selected MIRTEC's MV-7 OMNI 2D/3D in-line AOI system. This machine features four 10MP side-view cameras in addition to the 15MP top-down camera.
26th March 2014

AOI for wave and selective solder THT and SMT manufacturing

AOI for wave and selective solder THT and SMT manufacturing
In Booth 115 at this month’s Apex exhibition, Mek will present additions to its line-up of AOI and Solder Paste Inspection (SPI) systems. The company's highlight of the show will be the SpectorBOX “Bottom-Up” Modular system specially engineered for wave and selective solder THT and SMT manufacturing. The Mek team will be on hand to deliver live demonstrations of the SpectorBOX.
14th March 2014

Tool for the precise inspection of adhesive beads

Tool for the precise inspection of adhesive beads
Suitable for the recognition of disruptions, slubs and contractions on adhesive beads, the EyeSens AdBead tool has been announced by Eye Vision Technology. A tool for the inspection of adhesive beads, the core of the machine vision system is a specially developed method for the control of adhesive bead surfaces.
3rd March 2014


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