Inspection & Test

Displaying 391 - 395 of 395

Vertex II X-ray Inspection System from VJ Electronix

VJ Electronix has announced that the company will display its new Vertex II next-generation X-ray technology and the high-performance SRT Micra rework platform in the Kasion Booth (1G56) at the NEPCON China 2013 exhibition and conference, scheduled to take place April 23-25, 2013 at the Shanghai World Expo Exhibition and Conference Center in Shanghai China.
28th March 2013

Suntron increases placement and inspection capabilities

With medical device OEMs requiring smaller, lighter, and longer lasting devices, Suntron Corporation announces that it has the capability to place and inspect the tiny packages needed for miniaturized medical device electronics. Suntron builds highly complex boards with 01005 components requiring the control of many variables during assembly process.
15th January 2013

New and Improved Technical Specification for the Nordson DAGE XD7800 Ruby XL X-ray Inspection System

Nordson DAGE has today announced the new and upgraded technical specification for its class leading X-ray inspection system dedicated for large area printed circuit boards. Now known as the XD7800 Ruby XL, in keeping with the rest of Nordson DAGE’s jewel range of X-ray inspection systems, it is focused and optimized for completely satisfying the needs of the electronics industry.
11th December 2012


COT expands Manufacturing Operations with a second Zeiss CONTURA G2 CMM

Count On Tools has today revealed another expansion of its manufacturing operations at its Gainesville, GA headquarters. The recent expansion is in response to the growing market for SMT nozzles and consumables as well as the increased demand for its precision contract machining services.
8th August 2012

Essemtec Provides High-Resolution SPI for Printing and Dispensing Processes

Essemtec Provides High-Resolution SPI for Printing and Dispensing Processes
Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such as solder paste inspection (SPI). Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported.
25th May 2011


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Vietnam International Defense & Security Exhibition 2020
4th March 2020
Vietnam National Convention Center, Hanoi