Suitable for in-line or off-line operation, Nordson DAGE has introduced an automated x-ray inspection system. The Xi3400 offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. The system's algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
The Xi3400 utilises the Nordson DAGE patented Digitial Tomosynthesis Technology to acquire multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.
“The Xi3400 integrates the automation software techniques developed at Nordson YESTECH with Nordson DAGE hardware technology. This new and improved AXI system expands the market leading capabilities of our test and inspection portfolio,” comments Joshua Petras, Business Director, Inspection Products, Nordson DAGE.