Test & Measurement

AOI for wave and selective solder THT and SMT manufacturing

14th March 2014
Nat Bowers
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In Booth 115 at this month’s Apex exhibition, Mek will present additions to its line-up of AOI and Solder Paste Inspection (SPI) systems. The company's highlight of the show will be the SpectorBOX “Bottom-Up” Modular system specially engineered for wave and selective solder THT and SMT manufacturing. The Mek team will be on hand to deliver live demonstrations of the SpectorBOX.

Designed to accommodate solder frames on return and/or feed conveyors, SpectorBOX offers bottom side, top side or simultaneous dual side inspection replacing traditional board flipping alternatives in less space and at a lower cost.With its totally new mechanical platform, Mek claim that it is the only modular AOI in the market that can be equipped with 9 cameras, including an optional Z-axis moveable head to precisely position and focus for varying PCB distance and warpage. With its general purpose I/O, SpectorBOX can be simply interfaced with existing or new conveyor systems.

Also on display will be the PowerSpector 350 desktop AOI with FDAz inspection head, which introduces a new era in capture quality. The FDAz inspection head enables 9 Camera AOI featuring Tilt-Shift & Telecentric optics with automatic Z-axis. 8 Side cameras in 10µ resolution with Tilt-Shift optics technology reduce image distortion to enable the best capture possible. A moveable head in Z-Axis brings objects into optimal focus and position, independent of PCB thickness or warping. In combination with the HD 18.75µ or 10µ resolution top camera with Telecentric optics and unique multiplexed 8x CameraLink side camera technology, unprecedented defect visibility is achieved.

Automatic Solder Paste Inspection leaped forward with the introduction of Mek 5D SPI PowerSpector S1mkII. Its patented advanced sensor technology with simultaneous 3D and 2D inspection lowers SPI process tolerances  to unmatched levels and extends SPI capabilities beyond any offered by 3D alone. True area, shape, volume, offset and height measurements are provided in combination, providing genuine process control and a perfect tool with which to adjust printer settings before a problem spreads throughout an entire production run.

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