Bottom-up AOI can utilise 9 camera angles

29th January 2015
Posted By : Barney Scott
Bottom-up AOI can utilise 9 camera angles

Mek (Marantz Business Electronics), will be showcasing the SpectorBOX “Bottom-Up” 3D Modular AOI system at Southern Manufacturing & Electronics, at the stand of its UK Distributor, Gen3 Systems Limited. The system replaces traditional board flipping alternatives, taking up less space and at lower cost.

Optimised for the inspection of wave and selective soldering of THT & SMT components, SpectorBOX is designed to inspect PCBs inside solder frames, directly from the conveyor system. With its mechanical platform, it is the only modular AOI in the market that can be equipped with 9 cameras, including an optional Z-axis moveable head to precisely position and focus for varying PCB distance and warpage.

The XY drive gantry with ball screw mechanics delivers high speed inspection, while maintaining high accuracy and precision. Specially coated shafts deliver quiet operation and minimise wear to virtually eliminate maintenance and calibration requirements. With its general purpose I/O, SpectorBOX can be simply interfaced with existing or new conveyor systems.

100% simultaneous inspection can be accomplished with two SpectorBOX platform modules combined for bottom and top sides, incorporating up to 18 cameras. Board sizes up to 550x520mm (21.7x20.5”) can be accommodated.


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