Combo-system for wire bond inspection exceeds expectations
Power module manufacturer Danfoss Silicon Power has supplemented its existing Viscom X8051 with additional X7056BO combo-systems for wire bond inspection. Using the recognition of bond feet to analyse how the wire must lie, the X7056BO inspects the path of the wire in wire bond connections with AOI. Boasting reduced acquisition costs, low false alarm rates and a high productivity, Danfloss currently has four X7056BO systems.
Before acquiring the systems, Danfoss Silicon Power intensively analysed the market offering for X-ray and AOI systems and tested different systems. "First we wanted to settle on two separate machines: one AOI and one X-ray inspection system," reports Torsten Hansen. "Until we determined that with Viscom, both technologies can be integrated very well."
During the course of the test phase, the company quickly recognised that the initial expectations for inspection quality and speed could be even further exceeded by minor adjustments and adaptations. "Today, the false alarm rate in many areas is better than the rate Viscom originally confirmed," reports Torsten Hansen.
"The savings gained through the Viscom X7056 are considerable", says Torsten Hansen. “For one, the acquisition costs already are significantly less in comparison to two individual machines. Additionally, productivity has distinctly increased."
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