Essemtec Provides High-Resolution SPI for Printing and Dispensing Processes

25th May 2011
Posted By : Nat Bowers
Essemtec Provides High-Resolution SPI for Printing and Dispensing Processes

Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such as solder paste inspection (SPI). Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported.

Traqu is not a traditional AOI but rather a 3-D inspection system for process optimization, monitoring and sample control. The infrared-interferometric sensor scans any 3-D structure, independent of material and surface. Depending on installed lenses, vertical resolution from 2-200 nm and a horizontal resolution from 1-20 µm can be achieved.

Traqu applications are versatile. In electronics production, Traqu is used for SPI and quality insurance for stencil printers. Solar cell manufacturers can measure the cross section of bars and fingers. LED manufacturers can measure the form and volume of dispensed lenses. Traqu can analyze any 3-D surface as well as measure coating thickness.

Programming and analysis are simple due to the simple Traqu software. The substrate layout is either imported from DXF or Gerber data or taught-in manually. The scan area is marked by drawing a box around it with the mouse. For PCB inspection, Traqu can be set to automatically scan all packages of the same type.

The desired type of analysis, measurement, calculation and result display is stored in a recipe for later reuse. The area of inspection covers 300x400 mm. Additionally, a flexible magnetic holder is integrated for any substrate type.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

SPS IPC Drives 2019
26th November 2019
Germany Nuremberg Messe
Vietnam International Defense & Security Exhibition 2020
4th March 2020
Vietnam National Convention Center, Hanoi