Test & Measurement

EyeVision 3.0 for the production of credit cards

9th November 2015
Jordan Mulcare
0

The EyeVision 3.0 image processing software is very flexible concerning its application possibilities. Therefore it is also applied at the production of credit cards. In the current case the BLOB command (object counter) is used. When manufacturing the cards, IC chips must be attached to the card properly using solder paste. The paste is dispensed to the cards at two positions and they must maintain certain amount and shape.

Our vision system inspects, if the sufficient amount of the paste is dispensed and checks if they are positioned at the right places. Nowadays the BLOB analysis can be used for many applications with time-consuming calculations. It can thereby also exclude connected regions on the base of their area characteristics, which are not of interest. Also statistic informations can be determined, such as e.g. the size or number of BLOBs, position and presence of BLOB regions.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier