The ZEISS Crossbeam 550 is said to feature a significant increase in resolution for imaging and material characterization and a speed gain in sample preparation. Nanostructures such as composites, metals, biomaterials or semiconductors can be investigated with analytical and imaging methods in parallel.
The Crossbeam 550 allows simultaneous modification and monitoring of samples, resulting in fast sample preparation and high throughput e.g. for cross-sectioning, TEM lamella preparation or nano-patterning.
According to ZEISS, it provides best image quality in 2D and 3D. The new Tandem decel mode enables enhanced resolution together with a maximization of image contrast at low landing energies. Its Gemini II electron optics delivers excellent resolution at low voltage and high probe current simultaneously. The FIB column combines the highest available FIB current of 100 nA with the new FastMill mode, allowing for highly precise and more efficient material processing and imaging in parallel. Additionally, the new process for automated emission recovery increases the user-friendliness and optimizes the FIB column for reproducible results during long-term experiments.
ZEISS Crossbeam 550 replaces its predecessor ZEISS Crossbeam 540 and is available in a variation with a large chamber for the first time. Selected product features can be upgraded for existing ZEISS Crossbeam 540 owners.