Inline 3D topographical & imaging AOI

12th January 2016
Posted By : Peter Smith
Inline 3D topographical & imaging AOI

The new ISO-Spector from Mek (Marantz Electronics) offers true measurement for across-the-board inspection of components and solder joints. Unlike other methods of height measurement, ISO-Spector technology enables inspection of heights up to 30 mm (1.2in).

The system is practically immune to vibrations from nearby placement machines which might otherwise cause blurry images and therefore inaccurate and non-repeatable results during production. It is able to inspect the world’s smallest chip size of 008004 (50% of 01005in) and features a full profile simultaneous 2D and 3D inspection while maintaining high inspection speed using patented sensor technology.

The image capturing sensor has a massive 12 Mega Pixel resolution with optical fibre interface. The ISO-Spector enables accurate height measurement by using front & rear, close to vertical, high energy, high-end violet lasers. These lasers, combined with proprietary algorithms, result in the minimization of blind spots (shadow) and the effect of reflecting objects. Warped PCB’s up to 4 mm (160 mils) are compensated for on the fly by the Z-axis and complex compensation algorithms.

Unique for these type of inspection systems, the ISO-Spector can be programmed and debugged offline using the offline programming and debugging stations. The 3D AOI system is ergonomically designed and operated via a full touch screen.


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