Keysight and Cohu to work on 5G chips test solution

Posted By : Mick Elliott

A collaboration between Keysight Technologies and Cohu, has been extended to deliver enhanced high volume manufacturing (HVM) solutions for the 5G semiconductor manufacturing test market. Integrating Keysight's 5G NR Signal Studio and PXI modular instruments with Cohu's HVM radio frequency (RF) test tools enables 5G semiconductor manufacturers to streamline the transition from device validation testing (DVT) to HVM.

Tightly integrated tools in both DVT and HVM allow users to easily correlate measurement test results, leading to faster time-to-volume (TTV) of 5G power amplifiers (PAs) and RF front-end modules (FEMs).

"We are excited to work with Cohu to make these best-in-class 5G manufacturing test solutions possible and to help PA/FEM manufacturers reduce the time and overall cost of testing as they transition from DVT to HVM," said Giampaolo Tardioli, vice president of Keysight's Network Access group.

Keysight's 5G solutions enable semiconductor providers and other wireless equipment manufacturers to address a diverse set of workflow test requirements, from design and simulation, to prototype test and manufacturing.

Leveraging Keysight's PathWave design and test software platform enables these solutions to offer a common environment across PA/FEM workflow solutions, while improving efficiency with common measurement IP and leverageable automation code.

"Keysight's expertise and 5G test solutions have helped Cohu deliver high volume manufacturing solutions with a competitive edge for the 5G semiconductor manufacturing test market," says Steve Wigley, vice president of the Semiconductor Test Group at Cohu. "The integration of Keysight's software and PXI modular hardware with our HVM RF test tools greatly simplifies the task of correlating measurement test results between design validation and manufacturing test, creating a significant advantage for our customers." Cohu supplies back-end semiconductor equipment and services, delivering solutions for the manufacturing of semiconductors and printed circuit boards. 

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LOPEC 2019
19th March 2019
Germany Messe Munchen