Microtronic installs Sonix ECHO at demo lab in Munich

Ernst J. M. Eggelaar, President of Microtronic, commented, “We are thrilled to present the latest developments and features of the Sonix ECHO to our customers. The system includes many cutting-edge features.”

With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 5 microns, the ECHO is perfect for MEMS, bonded wafers, bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.