Test & Measurement

productronica: Bed-of-nails tester cuts test costs

16th November 2017
Mick Elliott
0

A scalable bed-of-nails test platform was showcased by SPEA at productronica in Munich. It delivers the high throughput (one system is typically able to replace two to six competitor machines, claims the company) and superior test coverage of component failures, process defects, components key parameters, for the widest range of electronic products.

This means the system is not only able to detect board failures, but also to monitor key parameters of critical components applying real working conditions (e.g. power components, sensing components, actuators).

This results in the capability to eliminate the occurrence of failures at the final functional test, while reducing to one tenth the field returns. 

Parallel test with up to eight cores multiplies by eight the productivity, compared to conventional test equipment, dramatically lowering the cost of test.

The system comes with manual board loading module, or with ultra-fast inline automatic handling, to meet the requirements of fully automated productions. 

An innovative multi-process platform manages the concurrent execution of multiple test techniques, optimising the test program, that combines in-circuit test (powered-up or not), optical inspection, boundary scan test, functional test, and more.

All of these functions are complemented by a friendly yet powerful software environment. 

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