A major player in global semiconductor manufacturing has installed XCerra’s MT2168 XT Semiconductor Test Handler. The handler meets the growing demand in high volume production for reliable and cost-efficient tri-temp test handling of multi-chip packages and modules in the automotive and consumer markets.
Today’s available equipment for module test handling are dedicated solutions with low throughput and limited temperature test capabilities. The MT2168 XT addresses the market need for a high volume production test solution for modules. It leverages the tri-temperature expertise of the Xcerra Handler Group specialists and provides advanced technical features of the latest generation of pick-and-place handler.
The MT2168 XT can be used for handling both package devices and modules.
Handling and testing modules can be challenging due to the physical dimensions and heterogeneous architecture of modules. The independent plunger force and temperature control provides better ability to handle modules and precisely control power dissipation for high test yield.
Integrating contacting solutions from Xcerra’s Interface Product Group can be an additional advantage for module testing. Extensive understanding of test contacting is beneficial for complex modules of different shapes and sizes.
Dr. Laurie Wright, Director Global Business Development, explains: “There is a growing demand in the semiconductor market for module test handling as customers seek to deliver greater value to their end customers. The MT2168 XT brings the advantages from high volume package test to module test. Customers will benefit from this highly flexible and reliable tri-temperature test solution