A new TDR Option for Advantest’s TS9000 series of terahertz analysis systems has been released. It enables analysis of circuit quality in semiconductors, printed substrates, electronic components, and other applications, utilising short-pulse terahertz waves.
Advantest will demonstrate its new TS9000 terahertz analysis systems for the semiconductor industry in at the International Microelectronics Assembly and Packaging Society conference in Orlando, Florida (Oct 27-29) IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies.
Electronic device circuit quality analysis is commonly performed using oscilloscope TDR (time domain reflectometry). However, as devices grow smaller and more highly integrated, the ability to locate failures with extreme spatial precision has become increasingly more important.
Existing measurement instruments have limited resolution, as the rise time of the short pulse cannot be compressed much further, creating the risk that existing analysis technologies will be inadequate to handle the requirements of the highly integrated devices on the horizon.
Advantest’s terahertz analysis technology addresses these concerns and meets the need for ultra-high-resolution measurement by utiliaing short-pulse terahertz waves for analysis of complex electrical circuits.
The TS9000 TDR Option relies on Advantest’s market-proven TDT/TDR* measurement technology to pinpoint and map circuit defects utilising short-pulse signal processing. The solution delivers circuit analysis with an extremely high spatial precision of less than 5μm, and a maximum measurement range of 300 mm, including for internal circuitry used in through-silicon vias (TSVs) and interposers.
Moreover, with the optional TDR/TDT CAD Data Link, errors located can be mapped and displayed on the CAD data of the target device, making it much easier for users to identify the causes of errors. Three types of TDR/TDT probes, each with a different resolution and measurement distance setting, are available for the TS9000 TDR Option, as are customisations for unique contact requirements.
Advantest announced the TS9000 MTA Option, a terahertz analysis system for measuring semiconductor mould thickness, in September 2014. With the launch of the TDR Option, the TS9000 Series continues to define the company’s new approach to measurement utilising terahertz technology, adding critical support for advanced electronic device measurement and product quality management.