Nordson DAGE has announced its most recent order from a major customer in the semiconductor industry for its XM8000 wafer X-ray metrology tool. It will be used for the automatic measurement of wafer bumps and Through Silicon Vias (TSVs) using 2D and 3D x-ray inspection methods.
David Bernard, Business Manager, Automated X-ray Systems, Nordson DAGE, commented, “The XM8000 represents an entirely new paradigm using Nordson DAGE’s award winning X-ray technology in the heart of semiconductor manufacture, and that is why our system was selected for this project. By offering full, nondestructive and automatic metrology, not only can the XM8000 measure the level of voiding in bumps and TSVs, something that is invisible to other test methods, but it also can measure their visible critical dimensions. Furthermore, it can do all this substantially faster and with greater precision than existing systems.”