Nordson DAGE has today announced the new and upgraded technical specification for its class leading X-ray inspection system dedicated for large area printed circuit boards. Now known as the XD7800 Ruby XL, in keeping with the rest of Nordson DAGE’s jewel range of X-ray inspection systems, it is focused and optimized for completely satisfying the needs of the electronics industry.
Able to take a maximum board size of 1205 x 672 mm (47” x 26.4”), the XD7800 Ruby XL also includes the unique, maintenance-free, Nordson DAGE NT500 160kV sealed-transmissive X-ray tube that provides up to 10W of target power at sub-micron feature recognition and the exclusive Nordson DAGE 2 Mpixel iDAT3 digital image intensifier detector with real time image enhancements. Together, the features of the XD7800 Ruby XL system allow it to cover all of the failure analysis and production inspection tasks that are required for large circuit board assemblies.
In addition to this new and improved specification, the XD7800 Ruby XL offers, for the first time, the ability to utilize Nordson DAGE’s award winning X-Plane™ analysis system option which allows X-ray inspection in any plane within the assembly, or its components, without the need to destroy these large, usually very expensive, assemblies, as would be necessary with traditional CT analysis.
Dr. David Bernard, Nordson DAGE Product Manager – X-ray systems said “This system configuration and specification is what the market has been asking for. Using a digital image intensifier detector with the sealed-transmissive X-ray tube in the Ruby XL means it has enough target power to image through the thickest backplane boards while still retaining sufficient resolution to detail the smallest features. Now when you add our X-Plane™ capability to this, which permits easy separation of features at different layers in the assembly to improve clarity of analysis, and all without the need to cut the board, then it is definitely the optimum solution”.