Software for inspection systems features µBGA analysis
Inspection plan generation and analysis software for inspection systems has been released by Viscom. SI 7.47 features Quality Uplink, a downlink function for Solder Paste Inspection (SPI), Integrated Verification, µBGA analysis and an XM converter.
The Quality Uplink function enables process optimisation through closed-loop feedback to the paste printer. Here, the SPI provides information about the paste print, and if the print image shifts during production it can automatically correct it. The way in which the print image is evaluated through the Quality Uplink function, also makes it possible to adapt the cleaning process to meet specific needs.
AOI program quality is enabled by the Instant Verification feature, through evaluating and saves real defects and pseudo defects at the verification station. With µBGA analysis, even the smallest BGA defects can be detected. This information can also reduce future pseudo defects if it is used for the generation of future inspection plans.
The SI 7.47 can convert inspection pattern libraries of the 4M, 6M or 8M camera technology to the XM camera technology and is suitable for use with MPM, Panasonic, DEK and Ekra printers.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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