Materials

Displaying 761 - 770 of 844

Non-toxic thermal fluid allows safer solar

Non-toxic thermal fluid allows safer solar
Thermal fluid specialist Global Heat Transfer has launched its first non toxic heat transfer fluid for solar applications, Globaltherm Omnipure. The high performance thermal fluid also boasts low flammability, making solar safer, while also reducing insurance and maintenance costs. Global Heat Transfer will showcase the product at the Menasol exhibition, hosted in Dubai from 13th to 14th May 2015.
16th April 2015

13.9cm2/V·s FET mobility achieved by liquid crystals

13.9cm2/V·s FET mobility achieved by liquid crystals
Researchers at Tokyo Institute of Technology and the Japan Science and Technology Agency have designed a liquid crystal molecule that produces high-performance organic field effect transistors with good temperature resilience and relatively low device variability, in addition to high mobility.
14th April 2015

Two-part epoxy displays low thermal resistance

Two-part epoxy displays low thermal resistance
Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15μm. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 2.88-3.60W/m·K, suitable for applications in the aerospace, optoelectronic and speciality OEM industries.
7th April 2015


Polymer-wrapped carbon nanotubes boast new abilities

Polymer-wrapped carbon nanotubes boast new abilities
Since scientists first reported carbon nanotubes in the early 1990s, these tiny cylinders have been part of the quest to reduce the size of devices and components. Carbon nanotubes, or CNTs, are 100 times stronger than steel and a sixth of the weight. They have several times the electrical and thermal conductivity of copper, and almost none of the environmental or physical degradation issues common to most metals, such as thermal contraction and expansion or erosion.
30th March 2015

Investment aims to speed new material R&D

The process of trial and error in scientific research is costly and time-consuming. And while scientific innovation and discovery is necessary to find solutions to some of society’s largest challenges - think clean energy, national security, more accessible technologies - the development of more efficient materials typically takes decades and millions of dollars.
27th March 2015

Is SiC key to high power semiconductor technology?

Is SiC key to high power semiconductor technology?
  Ewan Ramsay, Principal Engineer, Raytheon UK, explains why SiC (Silicon Carbide) holds the key to high power semiconductor technology and how it can help push electronics further into harsh environments.
27th March 2015

Graphene fabrication process enables consistent quality

Graphene fabrication process enables consistent quality
Helping industry unlock graphene’s potential, 2-DTech has made advances in the fabrication of graphene products using Chemical Vapour Deposition (CVD) techniques. Thanks to its CVD chambers and associated hardware, along with its team of experienced technical staff, the company is now able to deliver high-quality polycrystalline graphene films.
25th March 2015

Thermal management comparison puts Cambridge on top

Cambridge Nanotherm has published results of a round of testing of several thermal PCB materials intended for use in LEDs, including its Nanoceramic thermal management substrates. The tests were conducted by The LIA Laboratories and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.
19th March 2015

Dielectric is specified for a 51-10,000pF capacitance range

Dielectric is specified for a 51-10,000pF capacitance range
Allowing for higher capacitance values in existing case sizes, the UX dielectric material has been introduced by DLI. Space qualified to MIL-PRF-38534 Class K, the 50V rated dielectric complements the existing 25V rated material. The material can be specified for use with the company’s standard thin film architectures, including Di-Caps, Border Caps, Bar Caps and Gap Caps.
18th March 2015

Compound exhibits a thermal conductivity of 2.6W/m°K

Compound exhibits a thermal conductivity of 2.6W/m°K
Fujipoly has announced an easy-to-apply, thermally conductive and electrically non-conductive silicone-based compound which exhibits a low thermal resistance. Sarcon SG-26SL delivers a thermal conductivity of 2.6W/m°K when dispensed between a component such as a CPU or power converter and a heat sink.
18th March 2015


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