SCHOTT is offering its HermeS wafers with hermetically sealed solid “Through Glass Vias” (TGV). HermeS glass substrates enable fully gastight and therefore long-term robust enclosures for MEMS devices. The fine pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS glass can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP) possible. Thanks to the extremely high reliability, HermeS wafer provides advantages in particular for MEMS devices used in industrial, medical and radio-frequency applications. SCHOTT will be presenting its wafers from November 11-14, 2014 at Electronica in Munich, Germany (Hall A3, Booth 339).