Materials

Displaying 821 - 830 of 877

Dry electrodes remove discomfort from EEG & ECG procedures

Holst Centre, imec and Datwyler Sealing Solutions are set to jointly present a novel polymer dry electrode. Soft, flexible, and optimised for skin-impedance noise, polymer dry electrodes are a promising alternative to conventionally used gel electrodes in biopotential signal recording, as well as for uncomfortable and painful dry electrodes with rigid metal pins.
5th December 2014

Wearable circuit materials can survive 100 wash cycles

Wearable circuit materials can survive 100 wash cycles
DuPont Microcircuit Materials has introduced a suite of stretchable electronic ink materials for use in smart clothing applications and other wearable electronics. The materials provide an elegant, manufacturing-ready alternative to many traditional methods of embedding electronics in clothing.
3rd December 2014

Collaboration promises to accelerate graphene research

Collaboration promises to accelerate graphene research
In order to proactively seek out opportunities for the deployment of graphene, 2-DTech has developed a progressively closer relationship with the University of Manchester. The two parties have signed a memorandum of understanding that will see them sharing their respective resources and expertise, as well as the cross-pollination of ideas.
28th November 2014


Challenges of high-performance electronics addressed by gel range

Challenges of high-performance electronics addressed by gel range
As more and more high performance electronics are utilised across a wide range of applications, there is a growing need to provide innovative thermal materials that can effectively manage heat dissipation challenges. In line with this need, Parker Chomerics is constantly evolving its range of THERM-A-GAP thermally conductive dispensing gels in order for customers to maintain both system performance and reliability.
24th November 2014

Gels evolve to meet heat dissipation challenges

Gels evolve to meet heat dissipation challenges
As high performance electronics spreads across a wide range of applications, it has stimulated a growing need to provide new innovative thermal materials that can effectively manage the heat dissipation challenges. To meet this need Parker Chomerics is constantly evolving its range of THERM-A-GAP thermally conductive dispensing gels in order that customers can maintain both system performance and reliability. 
18th November 2014

Heat curable laminate material targets structural-bonding

Heat curable laminate material targets structural-bonding
Designed for structural-bonding applications requiring high thermal performance with absorption of mechanical stresses, the Bond-Ply LMS-HD has been released by Bergquist. The laminate material consists of a thermally conductive low-modulus silicone compound coated on a cured core and double lined with protective films.
12th November 2014

SCHOTT HermeS Glass Wafers with Through Glass Vias for MEMS technology

SCHOTT HermeS Glass Wafers with Through Glass Vias for MEMS technology
SCHOTT is offering its HermeS wafers with hermetically sealed solid “Through Glass Vias” (TGV). HermeS glass substrates enable fully gastight and therefore long-term robust enclosures for MEMS devices. The fine pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS glass can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP) possible. Thanks to the extremely high reliability, HermeS wafer provides advantages in particular for MEMS devices used in industrial, medical and radio-frequency applications. SCHOTT will be presenting its wafers from November 11-14, 2014 at Electronica in Munich, Germany (Hall A3, Booth 339).
11th November 2014

Thermal interface material offers 2.5W/m°K conductivity

Thermal interface material offers 2.5W/m°K conductivity
Manufactured in a versatile sheet form to be die cut or trimmed to perfectly fit application requirements, the Sarcon PG25A thermal interface material has been introduced by Fujipoly. The extremely soft, gel like compound provides a thermal conductivity of 2.5W/m°K with a thermal resistance of 0.24-1.7°Cin2/W, depending on sheet thickness and compression.
31st October 2014

CVD SiC & PBN materials can be used as tools for LEDs

CVD SiC & PBN materials can be used as tools for LEDs
Suitable for use in semiconductor applications, CVD SiC and PBN materials have been introduced by Morgan Advanced Materials. The applications in which the materials are suitable for include rapid thermal processing and plasma etch process chamber components. The materials can also be used as metalorganic CVD tools for high-brightness white LED manufacturing using the indium gallium nitride process. 
10th October 2014

Material delivers thermal conductivity of 2.1W/m°K

Material delivers thermal conductivity of 2.1W/m°K
The SARCON SPG-15A, a form-in-place thermal interface compound from Fujipoly, has been updated. The easy to dispense SARCON SPG-20B, is a low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1W/m°K and a thermal resistance of 1.8°Cm2/W.
19th September 2014


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