Materials

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CVD SiC & PBN materials can be used as tools for LEDs

CVD SiC & PBN materials can be used as tools for LEDs
Suitable for use in semiconductor applications, CVD SiC and PBN materials have been introduced by Morgan Advanced Materials. The applications in which the materials are suitable for include rapid thermal processing and plasma etch process chamber components. The materials can also be used as metalorganic CVD tools for high-brightness white LED manufacturing using the indium gallium nitride process. 
10th October 2014

Material delivers thermal conductivity of 2.1W/m°K

Material delivers thermal conductivity of 2.1W/m°K
The SARCON SPG-15A, a form-in-place thermal interface compound from Fujipoly, has been updated. The easy to dispense SARCON SPG-20B, is a low-viscosity thermally conductive silicone that delivers a thermal conductivity of 2.1W/m°K and a thermal resistance of 1.8°Cm2/W.
19th September 2014

TPU materials extend the life of industrial cables

For use in offshore, oil, gas and mining wire and cable applications, two UV protected grades of TPUs (Thermoplastic Polyurethanes) have been released by Huntsman. The IROGRAN TPU materials, which are polyether-based, are designed for encasing the cables of heavy-duty pieces of equipment. Such cables function in harsh, abrasive and outdoor environments, and are exposed to the elements.
18th September 2014


SiC materials target rapid thermal processing

SiC materials target rapid thermal processing
Suitable for rapid thermal processing and plasma etch process chamber components, Chemical Vapour Deposition (CVD) SiC and Pyrolytic Boron Nitride (PBN) materials have been introduced by Morgan Advanced Materials. The materials are also suitable as metalorganic CVD tools for high-brightness white LED manufacturing using the indium gallium nitride process. 
17th September 2014

A no mess alternative to conventional thermal pastes

A no mess alternative to conventional thermal pastes
Easily trimmed to required sizes with minimal wastage, the TGR200 thermal transfer sheet has been introduced by ARCOL. This no-shrink, 100% coverage, no mess alternative to conventional thermal pastes is supplied as a flexible dry mat, providing high performance heat transfer without the need for wasteful and messy assembly processes.
16th September 2014

Isola complies with space agency's material specification

After working in collaboration with the European Space Agency (ESA), Isola now complies with the ESA's specification for a cleaner class of base materials. Known as Appendix A, the standard defines the additional requirements to the Institute for Interconnecting and Packaging Electronic Circuits’ standard IPC-4101-D: Specification for Base Materials for Rigid and Multilayer Printed Boards.
16th September 2014

Conformable TIM offers thermal conductivity of 11 W/m°K

Conformable TIM offers thermal conductivity of 11 W/m°K
The introduction of a 1.0 mm thick sheet signals an expansion of Fujipoly’s Sarcon XR-Pe product offering. Conforming to most CPU and semiconductor shapes, the material offers thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.
29th July 2014

Supercapacitor materials market to reach $5bn by 2025

Based on the report 'Functional Materials for Supercapacitors / Ultracapacitors / EDLC 2015-2025', IDTechEx has forecast that the market for functional materials for supercapacitors will reach $5bn by 2025.
25th July 2014

Low bio-persistent solution performs at up to 1300°C

Low bio-persistent solution performs at up to 1300°C
A low bio-persistent solution ideal for use in ceramics, glass and metals manufacturing processes, as well as in commercial automotive and consumer goods applications, has been introduced by Morgan Advanced Materials. Offering a low bio-persistent-solution, the Superwool fibre papers are non-wetting to molten aluminium and feature low thermal conductivity, excellent tensile strength, thermal stability, and resistance to chemical attack. 
17th July 2014

Nanoparticle ink suits room-temperature printing

Nanoparticle ink suits room-temperature printing
A nanoparticle ink which can be used in room-temperature printing has been developed by MANA. Previously, nanoparticle inks could only be used in high-temperature printing because they were surrounded by non-conductive ligands and required annealing. Researchers have created a nanoparticle ink surrounded by planar aromatic molecules which, therefore, does not require annealing.
10th July 2014


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