Component Management
Alcohol-based fluxes from Emil Otto
These are multi-fluxes, which can be used for various soldering tasks. Manual and dip soldering are used at many companies in addition to the wave and selective soldering process. Emil Otto GmbH's alcohol-based fluxes are designed for this broad application spectrum.
Process could transform plastics and rubber industries
A scientific team from the University of Delaware, the University of Minnesota and the University of Massachusetts has invented a process to make butadiene from renewable sources like trees, grasses and corn. The findings, now online, will be published in the American Chemical Society's ACS Sustainable Chemistry and Engineering.
Metallic 'space fabric' links fashion and engineering
Raul Polit Casillas grew up around fabrics. His mother is a fashion designer in Spain, and, at a young age, he was intrigued by how materials are used for design. Now, as a systems engineer at NASA's Jet Propulsion Laboratory in Pasadena, California, he is still very much in the world of textiles. He and his colleagues are designing advanced woven metal fabrics for use in space.
PCB Cleaners introduced at NEPCON 2017
Introducing its three new circuit board cleaners, MicroCare will be at the enormous NEPCON Shanghai Exposition in April 2017. These products use novel chemical formulations not previously on the market from any vendor to help companies lower their PCB cleaning costs, improve product quality and meet ever-more stringent regulatory obligations.
Vapor degreaser cleaners at NEPCON Shanghai
MicroCare says it will use NEPCON Shanghai (25-27 April) to highlight three new cleaning chemistries in the Tergo family: Tergo Metal Cleaning Fluid, the Tergo Chlorine-Free Cleaning Fluid and the Tergo Flux Remover. The Tergo Flux Remover is a non-flammable, low-temperature cleaning fluid engineered for cleaning PCBs in vapor degreasers. This cleaner features a non-volatile additive specifically engineered to clean challen...
Aeroplane windows modify their transparency at passengers' request
Researchers have developed smart aeroplane windows able to modify their level of transparency at the request of passengers. Besides making air travel cosier, the new technology promises a significant reduction in energy consumption. Electrochromic windows can contribute to passengers' comfort, allowing them to control the amount of sunlight coming into the cabin. This type of smart window can switch from a colourless transparent state to a d...
Transforming waste glass bottles into batteries
Researchers at the University of California, Riverside's Bourns College of Engineering have used waste glass bottles and a low-cost chemical process to create nanosilicon anodes for high-performance lithium-ion batteries. The batteries will extend the range of electric vehicles and plug-in hybrid electric vehicles, and provide more power with fewer charges to personal electronics like cell phones and laptops.
Surface mounter offers 200,000cph placement capability
Yamaha Motor IM Europe is to showcase the YSM40R Ultra-High-Speed Modular surface mounter as part of its full line solution at SMT Hybrid Packaging 2017 in Nuremberg May 16-18, booth 321, Hall 4. The YSM40R’s 200,000cph placement capability and area-efficient 1m-wide outline frees OEMs and contract assemblers to increase capacity and maximize use of available space.
Family of vapour degreaser cleaners introduced at NEPCON
MicroCare Asia will use NEPCON Shanghai, 25th-27th April as the platform in which to highlight three innovative new cleaning chemistries of the Tergo family: the Tergo Metal Cleaning Fluid, the Tergo Chlorine-Free Cleaning Fluid and the Tergo High-Performance Flux Remover. For NEPCON, the most important of these is the Tergo High Performance Flux Remover because NEPCON is primarily an electronics assembly exposition.
Report examines the latest in packaging technologies
As the development of packaging technologies intensifies, in order to accommodate further front-end scaling trends and multi-die integration, advanced FO RDL and FC substrates represent the key interconnect components. The competition between FO and FC packages and the features of their interconnect components is resulting in an abundance of new package architectures that are crucial in enabling future products and markets.