Component Management

A no mess alternative to conventional thermal pastes

16th September 2014
Nat Bowers
0

Easily trimmed to required sizes with minimal wastage, the TGR200 thermal transfer sheet has been introduced by ARCOL. This no-shrink, 100% coverage, no mess alternative to conventional thermal pastes is supplied as a flexible dry mat, providing high performance heat transfer without the need for wasteful and messy assembly processes.

Capable of extended service life without degradation or shrinkage, the thermal transfer sheet provides fast, clean assembly and eliminates any risk of contamination as it contains no oils. The sheet can be shaped to suit industry standard resistor packages or in cut lengths, rolls or sheets to speed the assembly process.

The TGR200 ensures a thermally efficient transfer of heat between the mounted product and heat sink with thermal resistance of less than 0.7°C/W and thermal conductivity of 3.58W/mK.  Electrically conductive and RoHS compliant, the thermal transfer sheet has a nominal thickness of 0.2mm; however other thickness are available on request.

“Our TGR200 thermal interface material can be used as part of a thermal management design for use with any form of heat-sink," stated Alun Morgan, Technical Manager, ARCOL Resistors. "Convenient to store without degrading, simple to use in assembly, rework or service situations TGR200 is a real alternative to thermal pastes.”

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