Component Management

Electronic thermal management

5th November 2016
Peter Smith
0

DuPont Electronic Materials has just announced the launch of a new portfolio of thermal solutions under the brand name DuPont Temprion thermal management materials. Visitors to electronica in Munich will be the first to see and discuss the new development.

The Temprion portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes.  In applications such as hand-held devices, computers, car batteries and high-power electronic motors where heat dissipation is a major concern, the use of Temprion can improve performance, reduce the risk of failure and allow engineers to design with confidence. 

“Thermal management is a significant challenge for application engineers,” said DuPont Electronic Materials Industrial Segment Leader Itaru Matsuyama. “Performance requirements continue to increase and with that comes added heat. Temprion was specifically designed to meet these growing needs and reliably deliver performance that can be counted on for the lifetime of an application.”

Thermal management materials play a critical role in ensuring electronic devices and electrical assemblies run properly.  If heat is not properly dissipated, it can result in catastrophic failure, including fire. The Temprion portfolio of products is said to offer excellent thermal conductivity, lower thermal resistance, greater heat dissipation and improved thermal stability during continuous use. 

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